Basic Soldering Procedure

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Basic Soldering Procedure

[YT]https://www.youtube.com/watch?v=eOl2SdLijwo&feature=youtu.be[/YT]

1.Clean the surface of the PCB

• A clean surface is very important for a strong, low resistance solder joint.

2.Component Placement

• In general it is best to start with the smallest and flattest components (resistors, ICs, signal diodes) and then work up to the larger components (capacitors, power transistors, transformers) after the small parts are done.

3.Apply Heat

• Apply a very small amount of solder to the tip of the iron. This helps conduct the heat to the component and board, but it is not the solder that will make up the joint.

4.Apply Solder To The Joint

• Once the component lead and solder pad have heated up, you are ready to apply solder.

• Touch the tip of the strand of solder to the component lead and solder pad, but not the tip of the iron. If everything is hot enough, the solder should flow freely around the lead and pad. You will see the flux melt liquify as well, bubble around the joint (this is part of its cleaning action), flow out and release smoke.

• Continue to add solder to the joint until the pad is completely coated and the solder forms a small mound with slightly concave sides. If it starts to ball up, you have used too much solder or the pad on the board is not hot enough.

5.Inspect The Joint and Cleanup

• Once the joint is made, you should inspect it. Check for shorts with adjacent pads or poor flow. If the joint checks out, move on to the next.