- Joined
- Oct 30, 2022
- Messages
- 714
History ng phone bago nag no power medyo ma lag at bagal ng response..
kaya naisipan e restart at ayon biglang vibrate na lng hanggang sa namatay na.
trace sa PSU (power supply) 0.126ma steady lang pag press ng power switch..
kaya CPU reworks uli..
Tools:
Hot air Quick 861dw..
BGA solder Paste 158deg melting point..
Disassemble phone and pull out CPU..
hot air profile 280• Air 30 for removing glue around CPU nozzle number 1
tapos preheat 309• air 35 nozzle number 2
Pull out Cpu
hot air 355• Air 60..

linisin glue sa cpu at board 310 heat 30 air at reball CPU..

install cpu 355 heat 60 air.
and done..



sana makatulong sa mga baguhan..
kaya naisipan e restart at ayon biglang vibrate na lng hanggang sa namatay na.
trace sa PSU (power supply) 0.126ma steady lang pag press ng power switch..
kaya CPU reworks uli..
Tools:
Hot air Quick 861dw..
BGA solder Paste 158deg melting point..
Disassemble phone and pull out CPU..
hot air profile 280• Air 30 for removing glue around CPU nozzle number 1
tapos preheat 309• air 35 nozzle number 2
Pull out Cpu
hot air 355• Air 60..

linisin glue sa cpu at board 310 heat 30 air at reball CPU..

install cpu 355 heat 60 air.
and done..



sana makatulong sa mga baguhan..