- Joined
- Oct 30, 2022
- Messages
- 714
History ng Phone:
biglang nag shut down habang nanonood ng Youtube..
Power comsumption sa schematic 0.07..
Power Supply current 0.139ma..
so alam na another cpu rework..
Tools:
Hot air Quick 861dw..
BGA solder Paste 158deg melting point..
Disassemble phone and pull out CPU..
hot air profile 280• Air 30 for removing glue around CPU nozzle number 1
tapos preheat 309• air 35 nozzle number 2
Pull out Ram and Cpu
hot air 355• Air 60..

Linisin ang glue sa board at cpu at ram sa hot air Profile na 310• 30 air..
reball cpu and ram..

Install na natin hot air 340• air 60 nozzle number 2 pa rin..
cool down and test..

and done..
no data lost kay client..

a step by step guide para sa mga gustong matuto ng cpu reball..
sana mag silbing reference sa inyo ito...
biglang nag shut down habang nanonood ng Youtube..
Power comsumption sa schematic 0.07..
Power Supply current 0.139ma..
so alam na another cpu rework..
Tools:
Hot air Quick 861dw..
BGA solder Paste 158deg melting point..
Disassemble phone and pull out CPU..
hot air profile 280• Air 30 for removing glue around CPU nozzle number 1
tapos preheat 309• air 35 nozzle number 2
Pull out Ram and Cpu
hot air 355• Air 60..

Linisin ang glue sa board at cpu at ram sa hot air Profile na 310• 30 air..
reball cpu and ram..

Install na natin hot air 340• air 60 nozzle number 2 pa rin..
cool down and test..

and done..
no data lost kay client..

a step by step guide para sa mga gustong matuto ng cpu reball..
sana mag silbing reference sa inyo ito...